电子零件的清洗应该算是电子行业中普遍头疼的一个问题。电子零件，如半导体管的壳座、IC的壳座、晶体的壳座、继电器的壳座、电子管座等都对清洗条件有着极其苛刻的要求，超声波清洗机解决了这一难题。
Cleaning electronic parts should be an issue of common headache in electronic industry. Electronic components, such as semiconductor tube shell seat, IC shell seat, crystal shell seat, the relay shell seat, electronic socket and so on cleaning condition is extremely demanding, ultrasonic cleaning machine can solve this problem.
PCB板的清洗。我国电子行业中，绝大多数企业都在使用PCB，PCB组件焊接采用的助焊剂分为水溶型、松香型和免清洗型三类，使用较多的为前两种，多采用超声波清洗（也有不少是采用酒精刷洗），免清洗型原则上应该不清洗，但是，目前世界各国的大多数厂家即使采用免清洗型焊剂焊接组件，仍需要清洗。特别是高密度PCB以及高密度IC出脚不清洗或不采用超声波清洗，必将导致高密度线路之间和IC出脚之间吸附尘埃，一旦环境湿度大，极易发生高密度线间和脚间短路而出现故障，而一旦环境干燥，短路故障又自行消失，这类故障又不易查找。所以世界各国的电子整机厂均坚持对PCB板作超声波清洗。在我国，军工电子整机厂已开始推广，并收到了因此举既提高了产品可靠性，又降低了售后服务成本的双重效益。纳美清洗在电子行业清洗的开发应用中一直处于行业前列。
Cleaning of PCB plate. The electronic industry, the vast majority of enterprises in the use of PCB, PCB with the welding flux components are divided into water soluble, rosin and free cleaning type three kinds, the use of more for the former two,use ultrasonic cleaning (there are a lot of alcohol is used to scrub), free cleaning type principle should be no cleaning, but, at present the majority of manufacturers in the world even with no clean type flux welding assembly, still need to be cleaned.Especially for high density PCB, high density IC feet without cleaning or not by ultrasonic cleaning, will cause between the high density line and between IC feetdust absorption, once the environmental humidity is big, prone to high density line and interpeduncular short-circuit fault occurs, and once the dry environment, the short circuit fault and disappear, this kind of failure is not easy to find. So the worldof electronic equipment factory are persist for ultrasonic cleaning on the PCB board. In our country, the military electronic machine factory has been extended,and received for it not only improves the product reliability, and reduces the double benefit of after-sales service cost. We in the development and application of electronic industry cleaning cleaning has been at the forefront of the industry.
接插件、连接件、转接器等器件的生产中，电镀和组装前也必须清洗，否则吸附在这些组装零件上的灰尘、油污必将影响其导电和绝缘性能，特别是一些复杂的多芯连接器尤其如此。
Connector, connector, adaptor device such as production, electroplating and the assembly must also be clean, otherwise the dust absorption, in these assembledparts of oil will influence the conductive and insulating performance, especiallysome complex multi pin connector.
电子材料加工成型后的清洗。如晶片、硅片、压电陶瓷片等电子材料是供给元器件厂家的产品，其产品出厂前必须清洗，特别是作出口业务的厂家，其产品清洗成为一大难题，超声波清洗是最有效的途径。
Cleaning electronic materials processing after forming. Such as wafer, wafer, a piezoelectric ceramic sheet and other electronic material is the supply ofcomponents of the product manufacturers, their products before they leave the factory must be cleaned, especially for the export business of the manufacturers,the products has become a big problem of cleaning, ultrasonic cleaning is the most effective way to.
电子元器件的基体清洗。电子元器件的基体是由半导体材料制成并封装在金属或塑料壳座中形成的，在封装前，不但对壳座必须清洗，而且也必须对基体进行清洗，如IC芯片、电阻、晶体、半导体、原膜电路等
Substrate cleaning electronic components. The matrix of electronic componentsare made of semiconductor material and is packaged in a metal or plastic shell seat is formed, in the package before, not only to the shell seat must be cleaned,but also must be cleaned substrates, such as IC chips, resistance, crystal,semiconductor, original film circuit etc